Failure Analysis Applied for Automated Testing Platform
碩士 === 國立高雄應用科技大學 === 電子工程系 === 106 === Due to the different system-in-package technology (SiP), the migration and development towards the nanometer generation has made the defects of product failures smaller and more difficult to be discovered and observed. In order to find out the specific cause o...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/858a39 |