An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials

碩士 === 明新科技大學 === 管理研究所碩士在職專班 === 106 === This study proposes Grey System models (GM) for the top 1 material ( Gold wire) usage forecasting semiconductor packaging and testing. The MAPE, MSE and Theil’U inequality coefficient were being used to evaluate the predictive errors of the models proposed....

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Main Authors: LEE, KUANG_YI, 李光益
Other Authors: WONG, HSIEN_LUN
Format: Others
Language:zh-TW
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/6cz4z3
id ndltd-TW-106MHIT1121009
record_format oai_dc
spelling ndltd-TW-106MHIT11210092019-05-16T00:15:34Z http://ndltd.ncl.edu.tw/handle/6cz4z3 An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials 灰預測理論應用於半導體封測業 物料預測與控管之研究 LEE, KUANG_YI 李光益 碩士 明新科技大學 管理研究所碩士在職專班 106 This study proposes Grey System models (GM) for the top 1 material ( Gold wire) usage forecasting semiconductor packaging and testing. The MAPE, MSE and Theil’U inequality coefficient were being used to evaluate the predictive errors of the models proposed. The time series data is obtained from SAP System. The empirical results show that Data during 2013 to 2015, NGBM model has a better predictive performance than GM(1,1) model and Arima model. In this research, we confirmed that the prediction error rate of the GM is less than 15%, therefore, that it can be applicable to medium-term time service data forecasting. WONG, HSIEN_LUN 王賢崙 2018 學位論文 ; thesis 57 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 明新科技大學 === 管理研究所碩士在職專班 === 106 === This study proposes Grey System models (GM) for the top 1 material ( Gold wire) usage forecasting semiconductor packaging and testing. The MAPE, MSE and Theil’U inequality coefficient were being used to evaluate the predictive errors of the models proposed. The time series data is obtained from SAP System. The empirical results show that Data during 2013 to 2015, NGBM model has a better predictive performance than GM(1,1) model and Arima model. In this research, we confirmed that the prediction error rate of the GM is less than 15%, therefore, that it can be applicable to medium-term time service data forecasting.
author2 WONG, HSIEN_LUN
author_facet WONG, HSIEN_LUN
LEE, KUANG_YI
李光益
author LEE, KUANG_YI
李光益
spellingShingle LEE, KUANG_YI
李光益
An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
author_sort LEE, KUANG_YI
title An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
title_short An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
title_full An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
title_fullStr An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
title_full_unstemmed An Application of Grey System Theory in Forecasting and Management for Semiconductor Packaging and Testing on Materials
title_sort application of grey system theory in forecasting and management for semiconductor packaging and testing on materials
publishDate 2018
url http://ndltd.ncl.edu.tw/handle/6cz4z3
work_keys_str_mv AT leekuangyi anapplicationofgreysystemtheoryinforecastingandmanagementforsemiconductorpackagingandtestingonmaterials
AT lǐguāngyì anapplicationofgreysystemtheoryinforecastingandmanagementforsemiconductorpackagingandtestingonmaterials
AT leekuangyi huīyùcèlǐlùnyīngyòngyúbàndǎotǐfēngcèyèwùliàoyùcèyǔkòngguǎnzhīyánjiū
AT lǐguāngyì huīyùcèlǐlùnyīngyòngyúbàndǎotǐfēngcèyèwùliàoyùcèyǔkòngguǎnzhīyánjiū
AT leekuangyi applicationofgreysystemtheoryinforecastingandmanagementforsemiconductorpackagingandtestingonmaterials
AT lǐguāngyì applicationofgreysystemtheoryinforecastingandmanagementforsemiconductorpackagingandtestingonmaterials
_version_ 1719162896728981504