UV light point array oblique scanning for 2D and 3D maskless lithography
碩士 === 國立成功大學 === 機械工程學系 === 106 === This study develops a UV spot array oblique scanning system to perform maskless lithography patterning. A UV light source of 405 nm I wavelength is used along with a digital micromirror device (DMD) to modulate the UV light and to form array of UV spots. The UV l...
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2018
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Online Access: | http://ndltd.ncl.edu.tw/handle/47kdqm |
Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 106 === This study develops a UV spot array oblique scanning system to perform maskless lithography patterning. A UV light source of 405 nm I wavelength is used along with a digital micromirror device (DMD) to modulate the UV light and to form array of UV spots. The UV light reflected by the DMD is projected by a projection lens into a microlens array and then focused into an array of pin-holes to filter out stray light. Finally, the spots are transmitted onto the substrate through another projection lens to expose a photoresist layer coated on a substrate. The sample is carried by an XYZ stages to perform oblique scanning lithography. The spot array size is 128x96 with an actual size of 14.08x10.056 mm2. An algorithm is developed to generate a series of images to control DMD and the exposure pattern on the substrate. A positive-tone photoresist (S1813) with a thickness of 1 um is used. The spot size of UV light is around 10 um. Finally, a PCB pattern with size of 100 by 50 mm2 is exposed and etched on a 6-inch glass substrate. The minimum linewidth is 7 um with a minimum increment of linewidth of 2.28 um. Also, this study develops an algorithm to simulate the exposure dosage by convolute the spot model with the scanning line with some modulation on the weightings of DMD. It demonstrates the possibility of using this maskless lithography system for grey-scaled UV patterning and 3D micro-fabrication.
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