Thickness Effect of Nickel Interlayer on the Properties after Aluminum and Alumina Interfacial Reactions
碩士 === 國立交通大學 === 材料科學與工程學系所 === 106 === Direct bonded copper (DBC) substrates have been widely used in power electronics and insulated gate bipolar transistors (IGBT) modules. However, poor thermal cycling reliability of DBC substrates restrict its applications. Direct bonded aluminum (DBA) substra...
Main Authors: | Wang, Yu-Ting, 王俞婷 |
---|---|
Other Authors: | Lin, Chien-Cheng |
Format: | Others |
Language: | zh-TW |
Published: |
2018
|
Online Access: | http://ndltd.ncl.edu.tw/handle/heshg2 |
Similar Items
-
Direct bonding of aluminum to alumina using a nickel interlayer for power electronics applications
by: Yu-Ting Wang, et al.
Published: (2020-06-01) -
Joining of Alumina to Aluminum and Its Interfacial Properties
by: Chun-Yu Lin, et al.
Published: (2014) -
Microstructure and Mechanical Properties of an Ultrasonic Spot-Welded Aluminum-to-Aluminum Joint: Response to Interlayer Thickness
by: Zeng-Lei Ni, et al.
Published: (2019-01-01) -
Interfacial reactions and microstructure related properties of explosively welded tantalum and steel sheets with copper interlayer
by: H. Paul, et al.
Published: (2021-10-01) -
Direct Bonded Aluminum/Alumina using Various Elements as Interlayer for High Power Device Substrate
by: Cheng, Yun-Hsiang, et al.
Published: (2019)