The Research of Suppliers’ Evaluation of the Materials for Wafer and IC Package Testing in Semiconductor Industry Case Study of Company A

• Main Authors: Tseng, Shu-Ru, 曾淑茹
• Other Authors: Chen, Quang-Hua
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/x96uh3

碩士 === 國立交通大學 === 管理學院高階主管管理碩士學程 === 106 === Wafer and IC package testing play the very important roles in supply chain of Semiconductor industry. The major functions of testing process are making sure the IC are functional、reliable、and stable before they are mounted on PCB. The purpose of using testing material is to support the testing process more efficient and exactly detect the failure packages. It can also avoid the failure IC packages shipped to customers. Company A is the no.1 assembly and testing house in the global semiconductor industry, they should have a guideline to make decision how to select the proper suppliers. The proper suppliers can provide the excellent support to Company A to ramp up their production efficiency、quality and the enterprise’s competitiveness through the supplier evaluation. Base on above, we refer AHP’s principle to study the suppliers’ evaluation of the materials for wafer and IC package testing in semiconductor industry. Firstly, we structure the 4 measured abilities, “Cost、Quality、Operation and Technology”, and 16 evaluation factors. Therefore, we interview the 15 experts in testing field of semiconductor industry to figure out what is the major concern and factors in their supplier evaluation. The research found that” Quality” is the most important measure ability. And from the factor ranking result, there are 4 factors are related to the” Quality” issue of the top 6. Therefore, we suggest Company A can focus on the quality issue and transfer the quality concept to cost model, it will be easier to understand the effective of quality.