Performance Optimization of Diamond Disks for Polishing Pad Conditioning during Chemical Mechanical Polishing Process

• Main Authors: Huang, Chen-Wei, 黃振偉
• Other Authors: Pan, Fu-Ming
• Format: Others
• Language: zh-TW
• Published: 2017
• Online Access: http://ndltd.ncl.edu.tw/handle/2w4wke

碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 106 === Chemical mechanical polishing (CMP) is an integrated circuit fabrication process for smoothing a solid surface using the combination of chemical and mechanical erosion methods. CMP can improve the uniformity of thin films for better control of subsequent processes. The polishing pad will degrade over time in CMP operations and requires continuing conditioning during the CMP process. To regenerate the surface condition of the polishing pad, a diamond disk are used to continuously remove debris left on the surface of the polishing pad and to reactivate pores of the pad. The diamond disk requires an optimized pad condition receipt (PCR) to achieve the desired conditioning quality of the polishing pad. The study focuses the dependence of CMP processes on the optimization of PCR. The success of a PCR is evaluated by the quality of Si wafers under the CMP operation and the polishing pad in terms of the removal rate of the polished material and the defect distribution on the wafers. Four PCRs were designed for the study, in which the polishing pad were evenly divided into 13 areas. The optimized PCR is determined by the dependence of the consumption of the polishing pad and the quality of the polished wafer on the moving course and the duration time of the diamond disk in each divided areas. The study demonstrates that satisfactory silicon polishing performance is achieved when the individual divided areas of the 3 polishing pad are uniformly consumed by the diamond disk conditioning.