Performance Optimization of Diamond Disks for Polishing Pad Conditioning during Chemical Mechanical Polishing Process
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 106 === Chemical mechanical polishing (CMP) is an integrated circuit fabrication process for smoothing a solid surface using the combination of chemical and mechanical erosion methods. CMP can improve the uniformity of thin films for better control of subsequent...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2017
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| Online Access: | http://ndltd.ncl.edu.tw/handle/2w4wke |