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• Main Authors: Kuo-Hsin Huang, 黃國鑫
• Other Authors: Zhen-Ming Chen
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/b62x2b

碩士 === 國立中央大學 === 工業管理研究所在職專班 === 106 === The Research uses Lean Six Sigma as principle to apply science method, information acquisition and presentation of Statistical data for PCB process yield improvement. Purpose- Find out the biggest impact for each process stage of PCB Welding, lower production cost by improving the product’s yield at each stage and reducing return of goods as well as customer complaints. Definition- Use PCB process’s defect ratio to perform the Pareto analysis and select functional test station as Critical to Quality (CTQ) to find out the critical stage and project established unit by SIPOC Chart. Measurement- Use Measurement Systems Analysis (MSA), Analysis of Process Capability and comparison of defective product to find out the root cause of quality issues, then to improve the quality. Analysis- Determine the significant and improvement factors by applying Design of Experiment (DOE). Improvement- Determine the key impact factors and characteristic limitation of the products by applying Response Curve of DOE. Control-Determine the key process parameters/factors for batch verification & validation. This research verifies the DAMIC method of Lean Six Sigma could save 30,000 US dollars a year by reducing average process DPMO from 1792 to 711. The effectiveness of yield improvement analysis can be verified in a short period-of-time by using statistic tools with well-developed workflow.