Identification of the Classifier for the Pattern of Spatial Randomness

• Main Authors: Ching-Ju Lin, 林敬儒
• Other Authors: Jwu-E Chen
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/f2kpd6

碩士 === 國立中央大學 === 電機工程學系 === 106 === In this paper, we find the relationship between diesize and Boomerang Chart base on wafer map which random distribution of defects. And building model by the relationship that let user just provided diesize to get bound of wafer cause by random defects. To achieve the aim of discrimination abnormal wafers fast. At first, we choose eight kinds of size of wafers to simulat bound accurately and carefully. We compared 4 kinds of distribution and several kinds of methods and linear regression order. To get the fitter and more convenient method. In Boomerang Chart, we discover that the centerline of all diesizes are almost collinear and the relationship between width and diesize in this experiment. Modeling base on the two factors to let user get bound of Boomerang Chart fast and accurately just provided diesize. In this experiment, the merits and demerits of two kind of methods are different. The simulation-base is more accurate but cumbersome and time-consuming. We spend lot of time generating random defect wafer and the time increases as the diesize increases. The rule-base is generating fast whatever diesize. Accuracy of bound is up to 95% although it is more imprecise.