| Summary: | 碩士 === 國立中央大學 === 環境工程研究所在職專班 === 106 === Electronic devices has been up to date with the improvement of technology and science. People’s demanding increase not only on software’s function but also on hardware of electronic equipment. As the demanding increases, the materials of making PCB(Printed Circuit Board) like copper, lead, nickel, gold and tin have been massively exploited. The situation resulted in danger nature resources. The process of exploitation leads to environmental pollution, waste liquid from production and disposal of sale products have severely caused the damage to eco-environment on earth. The process of PCB uses the gold plating.When the sediment of gold thickness’s uniformity is bad, it will cause overuse of gold salt.Affect the metal ion to reach electrode surface, including three functions of pervasion、convection and moving.According to analyze the process of plating gold base on above three functions, the correspondent mechanisms are ion moving caused by electric field, pervasion of fluid medicine density and ion circulating caused by fluid medicine activity. By studying these to improve gold thickness’s uniformity and reduce the gold salt. We study plating gold line A and evaluate in PCB industry.The research shows that, by adjusting the direction of jet stream to change the circulation of ion, furthermore to control the sediment of gold ions to improve gold thickness’s uniformity. The related plating industry can use this research method.
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