| Summary: | 碩士 === 南亞技術學院 === 機械工程系機械與機電工程碩士班 === 106 === In this paper, a research is conducted on the thermal efficiencies of thermoelectric coolers, a current industrial semiconductor product, in a water recirculating water cooling heat disipation using a regular single-stage thermoelectric module TEC1-127.05 as the research material. The study emphasizes on thermal reduction tests using different special thermal conducting materials between the thermal ceramic portion of the cooler and the thermal conducting copper plate by applying a DC of 12 V and recording the results for comparison.This research optimize the cooling water and pipe material svaried, utilizes Tauchi-method L9(33) Orthogonal Array table to do experimental design. It also utilizes The Minimum-the-Better quality characteristics produce the SN ratio, discovered that cooling water,Temperature and pipe material,heatsource temperature ,these factors change can affect the thermal reduction and thermal efficiencies varied. As to Taguchi Method, which truly provides both the cooling water Temperature and pipe materials varied and the effective experiment principle, reduces simulation frequency as far as possible. Through the（Minimum -is-best） quantity analysis to discover the influence simulate result the principle factor.
This is performed so that thermal reduction and thermal efficiencies can be achieved without using energy consuming heating methods, such as through cooling fan or a Compressor for heat sourcewater coolingheat dissipation and thermal reduction.
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