A STUDY OF INTERACTION PERFORMANCE ON HIERARCHICAL MENU DESIGN IN 3D STEREOSCOPIC AND REAL ENVIRONMENTS

碩士 === 國立臺灣科技大學 === 工業管理系 === 106 === Nowadays 3D application usage become more popular. Many people are becoming intimate with the use of 3D application. However, there are still some problem with the interaction in 3D environment. Especially in direct interaction, people usually feel difficulty wh...

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Bibliographic Details
Main Authors: Getrudis Cintya Bedu, 鄭新愛
Other Authors: Chiu-Hsiang Lin
Format: Others
Language:en_US
Published: 2018
Online Access:http://ndltd.ncl.edu.tw/handle/29e9dd
Description
Summary:碩士 === 國立臺灣科技大學 === 工業管理系 === 106 === Nowadays 3D application usage become more popular. Many people are becoming intimate with the use of 3D application. However, there are still some problem with the interaction in 3D environment. Especially in direct interaction, people usually feel difficulty when they interact with 3D object directly. Therefore, this study observe interaction performance on hierarchal menu design in the real and stereoscopic environment. This study using direct interaction technique to interact with the menu. In this study, five variables measured such as movement time, performance, accuracy, correction time and peak velocity. There were two kind of environment, three levels of depth and three index of difficulty that consider in this study experiment. This experiment recruit 12 voluntary participants with normal eyes condition. The result in this study show direct interaction performance better in real environment than in stereoscopic environment. In the stereoscopic environment, participant perform longer time and slower than in real environment. Levels of depth not give significant value almost in all variable except accuracy. It explain participant can perform in each levels of depth. The finding of this study can be important aspect to be consider for development in hierarchical menu design in 3D stereoscopic environment. This study also can contribute to improve direct interaction in future 3D application.