| Summary: | 碩士 === 國立臺北科技大學 === 分子科學與工程系有機高分子碩士班 === 106 === The purpose of this project is mainly focused on “synthesis and properties of novel photosensitive polyimides (PSPI) for potential FPC application”. The novel PSPIs show high thermal stability, superior mechanical properties, and high resolution for FPC application. Our studies include (1) Preparation of photosensitive polyimide layer with high thermal stability, which contains alicyclic diamine and photosensitive acrylic moieties. (2) Preparation of photosensitive epoxy-based adhesion layer by modifying commercial epoxy resin. The dimensional stability is enhanced through the crosslinking of coupling agent and photosensitive moiety. The ratio of photosensitive double bond is controlled by the ratio of acrylic acid modification on epoxy. (3) Optimization on the performance of polyimide and epoxy double layer films based on (1) and (2) through processing condition and verification of chemical structures. (4) Introduction hydroxyl functionality to improve adhesion for application of monolayer PSPI architecture.
Ionic type photosensitive polyimides can form photo-crosslinking by introduction the acrylic group such as 2-methyl acrylic acid 2-dimethylamino-ethyl ester (MDAE), that could effectively prepared negative-type photoresist patterns after developing in 1 wt % Na2CO3 (aq). Using different monomer can enhance adhesion、thermal and mechanical properties to avoid the material peeling, which could lead to electronic components leakage. The photosensitive formula exhibited the negative-type photoresist pattern that had 15 μm thickness and resolution of L/S 20. The above results indicated that polyimide precursor and epoxy resin system not only retains good mechanical properties and thermal properties, but also could be photo-patterned with a good resolution , which could be potentially used in flexible printed circuit board.
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