Improving Open and Short of Circuit in the Outer Layer of PCB by Six Sigma Method – a Case Study of E Company

• Main Authors: Chun-Ta Lu, 盧俊達
• Other Authors: Chuen-Sheng Cheng
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/ztjk35

碩士 === 元智大學 === 工業工程與管理學系 === 106 === The printed circuit board is a capital-intensive industry. When the E company was established, it was unable to purchase large-scale high-precision equipment for production because of its small amount of capital. Therefore, the sales strategy was mainly to elasticize a small number of products. This kind of ordering mode is characterized by a short delivery time, which requires sincere communication with customers, consistent quality, timely delivery, and customer satisfaction at any time. This study is mainly to use the improved architecture of DMAIC in the six-sigma to analyze problems and experimental plans and apply statistical methods to analyze them. Try to identify important influencing factors, improve them, and finally make the manufacturing process the most. The best method is to control and monitor the effectiveness of improvement to improve customer satisfaction. The company's internal competitiveness can be enhanced by improving the project and evaluating the company's overall benefits. Finally, the production environment and process conditions were optimized. The benefits were short-circuited, the number of circuit breakers dropped from 20.69% to 5.31%, and the financial benefits of this project are an 80% reduction in customer discounts for deductions. In addition, the intangible benefits brought by this project are to enhance the company's productivity and competitiveness and achieve the goal of sustainable development.