Effects of Ge additions in Sn-Ag-Cu lead-free solders on the interfacial reactions with Co substrate
碩士 === 國立中正大學 === 化學工程研究所 === 107 === The amount of the IMC would influence the reliability a lot. Usually, alloying the solder with additional elements to decrease its thickness is a great method. This research put emphasis on the interfacial reaction between solders containing Ge and metal substra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u2mgrk |