A Simulative Study on Invar Electrodeposition with Electroplating Tank

碩士 === 國立中興大學 === 化學工程學系所 === 107 === Nowadays, the fine metal mask required by the industry, deposited by Invar plating with a low thermal expansion coefficient and the thickness should be less than 30 μm with a unit plating deposition area of 200×700 mm2. Using the software to simulate the deposit...

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Bibliographic Details
Main Authors: Yu-Chih Lee, 李有植
Other Authors: 張厚謙
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/vry29z

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