| Summary: | 碩士 === 國立中興大學 === 化學工程學系所 === 107 === Polyimide (PI) is dynamic and rollable products because it has thin and flexible characteristics, also, it has high thermal stability, good mechanical strength. PI will directly be metalized by electroless deposition and then electroplating to form conducting lines. Because the Copper line on the PI surface is very thin and micro-scaled, the peeling strength is a very critical target in this metallization.
In this study, we used an overall wet process to directly metalize the PI film. Electroless deposition of M-N-P alloy films (Interlayer，IL) was performed on a PI film as a seed and a barrier layer followed by copper electroplating.
In our research, it was found that solution composition and process parameters will affect the adhesion between the M-N-P alloy films and the PI film. Using the Electro-spectroscopy for chemical analysis (ESCA) to explore the reasons for the decrease in adhesion before and after heat treatment. Finally, the influence of the copper electroplating stress on the adhesion of the overall metal film is discussed.
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