3D Structured Devices Developed by Through Silicon Via Technology

博士 === 國立成功大學 === 微電子工程研究所 === 107

Bibliographic Details
Main Authors:	Chun-LiangLu, 盧俊良
Other Authors:	Shoou-Jinn Chang
Format:	Others
Language:	en_US
Published:	2019
Online Access:	http://ndltd.ncl.edu.tw/handle/gj3dcn

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spelling	ndltd-TW-107NCKU54280042019-10-25T05:24:17Z http://ndltd.ncl.edu.tw/handle/gj3dcn 3D Structured Devices Developed by Through Silicon Via Technology 以矽穿孔技術研製三維結構之元件 Chun-LiangLu 盧俊良博士國立成功大學微電子工程研究所 107 Shoou-Jinn Chang 張守進 2019 學位論文 ; thesis 98 en_US
collection	NDLTD
language	en_US
format	Others
sources	NDLTD
description	博士 === 國立成功大學 === 微電子工程研究所 === 107
author2	Shoou-Jinn Chang
author_facet	Shoou-Jinn Chang Chun-LiangLu 盧俊良
author	Chun-LiangLu 盧俊良
spellingShingle	Chun-LiangLu 盧俊良 3D Structured Devices Developed by Through Silicon Via Technology
author_sort	Chun-LiangLu
title	3D Structured Devices Developed by Through Silicon Via Technology
title_short	3D Structured Devices Developed by Through Silicon Via Technology
title_full	3D Structured Devices Developed by Through Silicon Via Technology
title_fullStr	3D Structured Devices Developed by Through Silicon Via Technology
title_full_unstemmed	3D Structured Devices Developed by Through Silicon Via Technology
title_sort	3d structured devices developed by through silicon via technology
publishDate	2019
url	http://ndltd.ncl.edu.tw/handle/gj3dcn
work_keys_str_mv	AT chunlianglu 3dstructureddevicesdevelopedbythroughsiliconviatechnology AT lújùnliáng 3dstructureddevicesdevelopedbythroughsiliconviatechnology AT chunlianglu yǐxìchuānkǒngjìshùyánzhìsānwéijiégòuzhīyuánjiàn AT lújùnliáng yǐxìchuānkǒngjìshùyánzhìsānwéijiégòuzhīyuánjiàn
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3D Structured Devices Developed by Through Silicon Via Technology

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