Irregular Bumps Design Planning for Modern Ball Grid Array Packages
碩士 === 國立交通大學 === 電子研究所 === 107 === In modern flip-chip packages, bumps are often placed irregularly due to different design needs. It costs a great amount of time and manual effort to generate substrate routing from bumps through vias to package balls. Moreover, any single model in prior works coul...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/jpvr56 |