| Summary: | 碩士 === 國立臺灣大學 === 工業工程學研究所 === 107 === Taiwan is the largest semiconductor foundry manufacturing economy and has become an important industrial cluster in the world. With the vertical disintegration of industrial value chain, the government is striving to support the development of the semiconductor industry, for example, strengthen the independent research and development, and promote relevant policies to make the development of the semiconductor industry more complete. However, the trend of Internet of Things (IoT), artificial intelligence (AI), 5G communication, and high-performance computing, make the demand for high-order advanced packaging technologies such as wafer level and fan-out packaging technology is growing. In addition, the gap widened between technology pioneers and technology laggards because the technology innovations and short product life cycles. Technology transfer has become an important key to the revolution since the wafer manufacturing and the packaging and testing factory have invested heavily in the integration of design, technology and systems. To understand of the technology transfer strategy of wafer level packaging companies in Taiwan''s semiconductor industry, this study conducts a case study through the collection of secondary data to explain the technology transfer execution in practice. Besides, this study analyze the evaluation criteria of the technology transfer partner and the formulation of the business strategy, and presented the empirical research of the object company as the verification. Finally, this study provides the conclusions, recommendations and management implications for the government and authorities to formulate strategies and goals in further policies.
|
|---|
