Study on Thermal Dissipation Performance of PCI Card in Server

• Main Authors: LU, FENG-YEN, 呂鋒彥
• Other Authors: SHAW, JIN-SIANG
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/v59fg6

碩士 === 國立臺北科技大學 === 機械工程系機電整合碩士班 === 107 === In this thesis, Computational Fluid Dynamics (CFD) software is used to calculate thermal performance of the Personal Computer Interface (PCI) card and discuss the heat dissipation scheme in the limited space of the server chassis. The main factors affecting the thermal performance of the PCI card in the server are the efficiency of the heat sink, the wind field temperature and the relative air volume flow rate flowing through the PCI card. In this study, not only discussing the changes of temperature and air volume flow rate in the relevant wind field, but also discuss the placement of high-power components such as the main chip on the PCI card, and whether the different layout of related components can further improve the thermal performance. Under the same boundary conditions, under the premise of saving energy and not increasing cost, the cooling fan is not added to find the optimal solution for the thermal performance design of PCI card. Results show that the thermal efficiency of the main chip on the PCI card would be different when it is placed, so the placement would be further divided into six locations to discuss, and the matching of the upper and lower two with the front, middle and back three segments would be six groups of locations. After optimizing the performance of the main heat sink, the main chip is placed in the middle and rear sections of the PCI card, and the thermal performance is optimal. Under different environmental boundary conditions, the temperature difference can reach 4 °C. The temperature difference between the up and down movement of the main chip is about 1~2°C, but the temperature difference between the front and the back can reach 3~4°C. If the heat sink efficiency is not good, the temperature difference of the mobile main chip on the PCI card is not significant. All of them are within 1 °C. Although the temperature nears the middle and a rear segment is lower, the difference can be ignored. It is hoped that the results of this study can be used for reference in the initial design of PCI cards in the future, so as to reduce the time for optimization of thermal performance and adjustment of circuit design.