Statistical analysis of electromigration lifetimes and void evolution in Cu interconnects

Statistical analysis of electromigration lifetimes and void evolution in Cu interconnects

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Bibliographic Details
Main Author:	Hauschildt, Meike
Format:	Others
Language:	English
Published:	2008
Subjects:	Interconnects (Integrated circuit technology) Copper > Industrial applications Electrodiffusion
Online Access:	http://hdl.handle.net/2152/1562

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