The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures

The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures

Not available === text

Bibliographic Details
Main Author: Borthakur, Swarnal
Format: Others
Language:English
Published: 2008
Subjects:
Dielectrics
Dielectric devices
Copper > Industrial applications
Online Access:http://hdl.handle.net/2152/1826
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spelling ndltd-UTEXAS-oai-repositories.lib.utexas.edu-2152-18262015-09-20T16:50:13ZThe effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structuresBorthakur, SwarnalDielectricsDielectric devicesCopper--Industrial applicationsNot availabletext2008-08-28T22:19:02Z2008-08-28T22:19:02Z20052008-08-28T22:19:02ZThesiselectronicb60167695http://hdl.handle.net/2152/1826622601283187663engCopyright is held by the author. Presentation of this material on the Libraries' web site by University Libraries, The University of Texas at Austin was made possible under a limited license grant from the author who has retained all copyrights in the works.
collection NDLTD
language English
format Others
sources NDLTD
topic Dielectrics
Dielectric devices
Copper--Industrial applications
spellingShingle Dielectrics
Dielectric devices
Copper--Industrial applications
Borthakur, Swarnal
The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
description Not available === text
author Borthakur, Swarnal
author_facet Borthakur, Swarnal
author_sort Borthakur, Swarnal
title The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
title_short The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
title_full The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
title_fullStr The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
title_full_unstemmed The effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of Cu/low-k interconnect structures
title_sort effects of post-ash cleaning and chemical treatments on the dielectric properties and reliability of cu/low-k interconnect structures
publishDate 2008
url http://hdl.handle.net/2152/1826
work_keys_str_mv AT borthakurswarnal theeffectsofpostashcleaningandchemicaltreatmentsonthedielectricpropertiesandreliabilityofculowkinterconnectstructures
AT borthakurswarnal effectsofpostashcleaningandchemicaltreatmentsonthedielectricpropertiesandreliabilityofculowkinterconnectstructures
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