Characterization of delamination in silicon/epoxy systems
Microelectronic devices are multilayered structures with many different interfaces. Their mechanical reliability is of utmost importance when considering the implementation of new materials. Linear elastic fracture mechanics (LEFM) is a common approach that has been used for interfacial fracture ana...
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| Format: | Others |
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2014
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| Online Access: | http://hdl.handle.net/2152/24770 |