APA (7th ed.) Citation

Justison, P. R. (2008). Analysis of electromigration in single- and dual-inlaid Cu interconnects.

Chicago Style (17th ed.) Citation

Justison, Patrick Ryan. Analysis of Electromigration in Single- and Dual-inlaid Cu Interconnects. 2008.

MLA (8th ed.) Citation

Justison, Patrick Ryan. Analysis of Electromigration in Single- and Dual-inlaid Cu Interconnects. 2008.

Warning: These citations may not always be 100% accurate.