Analysis of electromigration in single- and dual-inlaid Cu interconnects

Analysis of electromigration in single- and dual-inlaid Cu interconnects

Not available === text

Bibliographic Details
Main Author: Justison, Patrick Ryan
Format: Others
Language:English
Published: 2008
Subjects:
Electrodiffusion
Copper > Industrial applications
Online Access:http://hdl.handle.net/2152/685

Internet

http://hdl.handle.net/2152/685

Similar Items