Thermal Cycling Fatigue Investigation of Surface Mounted Components with Eutectic Tin-Lead Solder Joints
International Telemetering Conference Proceedings / October 28-31, 1996 / Town and Country Hotel and Convention Center, San Diego, California === Eutectic (63% tin-37% lead) or near-eutectic (40% tin-60% lead) tin-lead solder is widely used for creating electrical interconnections between the printe...
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| Language: | en_US |
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International Foundation for Telemetering
1996
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| Online Access: | http://hdl.handle.net/10150/611418 http://arizona.openrepository.com/arizona/handle/10150/611418 |