Accelerated Reliability Testing of Fresh and Field-Aged Photovoltaic Modules: Encapsulant Browning and Solder Bond Degradation
abstract: The popularity of solar photovoltaic (PV) energy is growing across the globe with more than 500 GW installed in 2018 with a capacity of 640 GW in 2019. Improved PV module reliability minimizes the levelized cost of energy. Studying and accelerating encapsulant browning and solder bond degr...
Other Authors: | Gopalakrishna, Hamsini (Author) |
---|---|
Format: | Doctoral Thesis |
Language: | English |
Published: |
2020
|
Subjects: | |
Online Access: | http://hdl.handle.net/2286/R.I.57321 |
Similar Items
-
Characterization and Analysis of Long Term Field Aged Photovoltaic Modules and Encapsulant Materials
Published: (2015) -
Comparison of Encapsulant Degradation between Glass/Backsheet and Glass/Glass Field-aged Photovoltaic Modules
Published: (2018) -
Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes
by: Longteng Li, et al.
Published: (2020-01-01) -
Comparison of Degradation Behavior of Newly Developed Encapsulation Materials for Photovoltaic Applications under Different Artificial Ageing Tests
by: Chiara Barretta, et al.
Published: (2021-01-01) -
Thermo-mechanical reliability of the VSPA package solder joints
by: Murphy, R. Sean
Published: (2007)