A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas

A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas

Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need...

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Bibliographic Details
Main Author: Iyer, Mahadevan Krishna
Published: Loughborough University 1994
Subjects:
621.31042
Components
Online Access:http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260980
id ndltd-bl.uk-oai-ethos.bl.uk-260980
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spelling ndltd-bl.uk-oai-ethos.bl.uk-2609802017-12-24T15:46:06ZA novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennasIyer, Mahadevan Krishna1994Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need for faster interconnects for gigabit logic MCMs has been discussed in this thesis. Techniques to avoid the problem of taking high speed interconnections through multilayer substrates include radiative and optical techniques. The present research work concentrates on a radiative interconnection technique.621.31042ComponentsLoughborough Universityhttp://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260980https://dspace.lboro.ac.uk/2134/27246Electronic Thesis or Dissertation
collection NDLTD
sources NDLTD
topic 621.31042
Components
spellingShingle 621.31042
Components
Iyer, Mahadevan Krishna
A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
description Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need for faster interconnects for gigabit logic MCMs has been discussed in this thesis. Techniques to avoid the problem of taking high speed interconnections through multilayer substrates include radiative and optical techniques. The present research work concentrates on a radiative interconnection technique.
author Iyer, Mahadevan Krishna
author_facet Iyer, Mahadevan Krishna
author_sort Iyer, Mahadevan Krishna
title A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
title_short A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
title_full A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
title_fullStr A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
title_full_unstemmed A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
title_sort novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
publisher Loughborough University
publishDate 1994
url http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260980
work_keys_str_mv AT iyermahadevankrishna anovelchiptochipradiativeinterconnectiontechniqueforgigabitlogicmultichipmodulesusingleakywaveantennas
AT iyermahadevankrishna novelchiptochipradiativeinterconnectiontechniqueforgigabitlogicmultichipmodulesusingleakywaveantennas
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