A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas
Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need...
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Loughborough University
1994
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.260980 |