Roughening of electrodeposited copper films: mass transport and additive effects

The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure.

Bibliographic Details
Main Author: Wood, Matthew Aaron Saunders
Published: University of Bristol 2008
Subjects:
Online Access:http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.492459
Description
Summary:The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure.