Roughening of electrodeposited copper films: mass transport and additive effects
The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure.
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University of Bristol
2008
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Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.492459 |
Summary: | The surface roughness growth of electrodeposited copper films was studied with a particular focus on mass transport effects and the influence of millimolar quantities of halide additives on the surface roughness scaling, the surface morphology and microstructure. |
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