Multi-chip module interconnections at microwave frequencies : electromagnetic simulation and material characterisation
In this work both the interconnections and materials used in multi-chip modules (MCMs) at microwave frequencies have been investigated. The electrical behaviour of the interconnections was studied using commercially available 2.SD and 3D electromagnetic simulators (HFSSTM, MDSTM and Momentum™). Stat...
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Middlesex University
1999
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.568374 |