A Three-tier bio-implantable sensor monitoring and communications platform

• Main Author: Sanni, Ayodele Adebayo
• Other Authors: Toumazou, Christofer
• Published: Imperial College London 2013
• Subjects: 621.3
• Online Access: http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.616830

One major hindrance to the advent of novel bio-implantable sensor technologies is the need for a reliable power source and data communications platform capable of continuously, remotely, and wirelessly monitoring deeply implantable biomedical devices. This research proposes the feasibility and potential of combining well established, ‘human-friendly' inductive and ultrasonic technologies to produce a proof-of-concept, generic, multi-tier power transfer and data communication platform suitable for low-power, periodically-activated implantable analogue bio-sensors. In the inductive sub-system presented, 5 W of power is transferred across a 10 mm gap between a single pair of 39 mm (primary) and 33 mm (secondary) circular printed spiral coils (PSCs). These are printed using an 8000 dpi resolution photoplotter and fabricated on PCB by wet-etching, to the maximum permissible density. Our ultrasonic sub-system, consisting of a single pair of Pz21 (transmitter) and Pz26 (receiver) piezoelectric PZT ceramic discs driven by low-frequency, radial/planar excitation (-31 mode), without acoustic matching layers, is also reported here for the first time. The discs are characterised by propagation tank test and directly driven by the inductively coupled power to deliver 29 μW to a receiver (implant) employing a low voltage start-up IC positioned 70 mm deep within a homogeneous liquid phantom. No batteries are used. The deep implant is thus intermittently powered every 800 ms to charge a capacitor which enables its microcontroller, operating with a 500 kHz clock, to transmit a single nibble (4 bits) of digitized sensed data over a period of ~18 ms from deep within the phantom, to the outside world. A power transfer efficiency of 83% using our prototype CMOS logic-gate IC driver is reported for the inductively coupled part of the system. Overall prototype system power consumption is 2.3 W with a total power transfer efficiency of 1% achieved across the tiers.