Vertically aligned multiwalled carbon nanotubes as electronic interconnects

The drive for miniaturisation of electronic circuits provides new materials challenges for the electronics industry. Indeed, the continued downscaling of transistor dimensions, described by Moore’s Law, has led to a race to find suitable replacements for current interconnect materials to replace cop...

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Bibliographic Details
Main Author: Gopee, Vimal C.
Other Authors: Silva, S. R. ; Allam, J. ; Stolojan, V. ; Thomas, O.
Published: University of Surrey 2017
Subjects:
Online Access:http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.703541

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