Thermal/mechanical/structural properties of polycrystalline diamond and novel layered materials for electronic devices
Under the ever-increasing requirements of higher power and higher radio-frequency in future power electronics and telecommunication applications, the thermal management of gallium nitride (GaN) based devices becomes crucial, this can be significantly improved by integrating high thermal conductivity...
Main Author: | Zhou, Yan |
---|---|
Other Authors: | Kuball, Martin |
Published: |
University of Bristol
2018
|
Subjects: | |
Online Access: | https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.761150 |
Similar Items
-
Modelling polycrystalline materials and interfaces
by: Bean, Jonathan
Published: (2017) -
Solution-processed layered inorganic materials as charge-injecting layers in polymer electronic devices
by: Reynolds, Kieran John
Published: (2003) -
Active devices in polycrystalline silicon
by: Meakin, Douglas Boyd
Published: (1992) -
TEM characterization of B-doped polycrystalline CVD diamond films correlated with micro PL studies
by: Mora MaÌrquez, AndreÌs Eloy
Published: (2003) -
Thermal Conductivity of Diamond
by: Martinez, M.
Published: (1976)