Testing signal integrity faults in VLSI circuits.

As the ever-advancing fabrication technologies in semiconductor industry enable the VLSI circuits with increasing integration and decreasing cost, the circuits suffer from much severer Signal Integrity (SI) faults, where SI is the capability of signals generating correct responses in their downstrea...

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Bibliographic Details
Other Authors: Zhang, Yubin
Format: Others
Language:English
Chinese
Published: 2011
Subjects:
Online Access:http://library.cuhk.edu.hk/record=b6075185
http://repository.lib.cuhk.edu.hk/en/item/cuhk-344818
Description
Summary:As the ever-advancing fabrication technologies in semiconductor industry enable the VLSI circuits with increasing integration and decreasing cost, the circuits suffer from much severer Signal Integrity (SI) faults, where SI is the capability of signals generating correct responses in their downstream circuits. SI faults are complex problems to tackle since SI may be damaged by numerous kinds of causes and SI faults may impact multiple aspects of circuits' performance. Such SI problems can seriously reduce product yield, result in function error or even permanently damage the chip. Therefore, effective testing methodologies are essential to alleviate SI problems by verifying the SI satisfaction of VLSI circuits efficiently. === Hereby the thesis has examined the SI problems systematically and proposed effective test methods corresponding to the specific feature of SI faults. Firstly, considering that SI on inter-core interconnects of SOCs is under severe danger, new test wrapper design has been proposed to achieve accurate SI test on interconnects. Secondly, test architecture has been optimized for cost reduction considering SI test and logic test simultaneously. Thirdly, the impact of power distribution network (PDN) defects on SI has been analyzed and efficient computation method has been proposed to identify those potentially harmful PDN defects. Effective test pattern manipulation method has also been proposed to improve test coverage of PDN defects. Fourthly, considering the increasing impact of process variation and aging effect on SI, an innovative online test architecture has been proposed, which can accurately measure the delay of critical paths when the circuit is working in function mode, where such valuable information is of great help for a variety of applications. === Zhang, Yubin. === Adviser: Qiang Xu. === Source: Dissertation Abstracts International, Volume: 73-06, Section: B, page: . === Thesis (Ph.D.)--Chinese University of Hong Kong, 2011. === Includes bibliographical references (leaves 121-133). === Electronic reproduction. Hong Kong : Chinese University of Hong Kong, [2012] System requirements: Adobe Acrobat Reader. Available via World Wide Web. === Electronic reproduction. [Ann Arbor, MI] : ProQuest Information and Learning, [201-] System requirements: Adobe Acrobat Reader. Available via World Wide Web. === Abstract also in Chinese.