Aging effects on microstructure and creep in Sn-3.8Ag-0.7Cu solder
Solder joints provide mechanical and electrical interconnections between electronic devices and packaging substrates in electronics applications. The different coefficient of thermal expansion (CTE) between substrate, silicon device and solder imposes strains on the solder joint. Creep constitute...
| Main Author: | |
|---|---|
| Other Authors: | |
| Published: |
Monterey, California. Naval Postgraduate School
2012
|
| Online Access: | http://hdl.handle.net/10945/3318 |