| Summary: | This study reports on an interfacial design method of CuSiC composites by means of nano-diamond/SiC composite particles in meltinfiltration process. In the case of CuSiC composites fabricated by melt-infiltration process, reaction layers consisting of spherical carbon particles and CuSi solid-solution alloys were observed as SiC particles reacted with melt Cu. Formation of reaction layers is not appropriate to obtain the predesigned characteristics such as physical and mechanical properties of the CuSiC composites. To overcome this problem, nanodiamonds, which were chemically inert with Cu, were bonded to the surfaces of SiC particles by amorphous silica as a bond material in order to shield the SiC particles from reacting with melt Cu. It was found that this shielding method enabled us to disperse SiC particles homogeneously in the Cu matrix without reaction layers. This interfacial design based on the composite particles should be expected to be applied to a promising mass production technology of metal-matrix composites (MMCs) due to its short processing time and large amount of production for processing composite particles. © 2022 Journal of Japan Institute of Copper.
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