Fabrication of wafer-level thermocompression bonding
Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail. One of the issues encountered in the process development was e-beam s...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2002.
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| Subjects: | |
| Online Access: | Get fulltext |