“... in the IC industry. The plastic-creep analyses of solder-bumped IC on substrate or printed circuit board...”
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“... in the global IC packaging industry. It is more lightly, smaller, shorter, and more advantages than the multi...”
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“..., low cost, high functionality and low-pollution in the semiconductor industry, the Sn-Ag and the Sn-Ag...”
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“... in the PBGA-388 (Plastic Ball Grid Array-388) packages to verify and ensure the credibility of this research...”
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