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MODAL TESTING AND ANALYSIS
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Bor-Tsuen Wang
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梁秀瑋
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Solder Ball Stress Prediction
Analysis
for Package with Compound Loadings of Random Vibration and Thermal Effect
by
Xiu-Wei Liang
,
梁秀瑋
Published 2010
“
... by the adoption of experimental
modal
analysis
(EMA) to validate the finite element (FE) model constructed by FE...
”
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梁秀瑋
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