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INTEGRATED CIRCUIT PACKAGING
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Chang-Chun Lee
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Search Results - INTEGRATED CIRCUIT PACKAGING
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INTEGRATED CIRCUIT PACKAGING
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1
Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking
Packaging
by
Chang-Chun Lee
,
Tzai-Liang Tzeng
,
Pei-Chen Huang
Published 2015-08-01
Subjects:
“
...3D-IC
packaging
...
”
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Article
2
Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests
by
Chang-Chun Lee
Published 2017-10-01
Subjects:
“
...3D
integrated
circuits
...
”
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Chang-Chun Lee
Pei-Chen Huang
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Tzai-Liang Tzeng
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