Showing 1 - 2 results of 2 for search 'MATERIALS PROCESSING', query time: 1.57s Refine Results
  1. 1
    Die-Attachment on Copper by Nanosilver Sintering: Processing, Characterization and Reliability
    by Zheng, Hanguang
    Published 2016
    Subjects: “...processing...”
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  2. 2
    Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste
    by Zheng, Hanguang
    Published 2014
    “... in the total packaging process. Sintered nanosilver paste may be used as a lead-free alternative to solder...”
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