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INTEGRATED CIRCUIT PACKAGING
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INTEGRATED CIRCUIT PACKAGING
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Package
-level Power Plane with Ultra-wide band Ground Bounce Noise Rejection
by
Ting-Kuang Wang
,
王挺光
Published 2005
“
... (GBN) on the chip,
package
, and printed
circuit
board (PCB). The GBN not only causes the signal...
”
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