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161by M. Bschorr, H.-J. Pfleiderer, P. Benkart, A. Kaiser, A. Munding, E. Kohn, A. Heittmann, H. Hübner, U. Ramacher“... connections between different stacked chips. The 3-D technology is based on stacking several active CMOS-ICs...”
Published 2006-01-01
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