Showing 1 - 11 results of 11 for search 'DIGITAL ELECTRONICS', query time: 0.68s Refine Results
  1. 1
    Chemical and Electronic Structure of Aromatic/Carborane Composite Films by PECVD for Neutron Detection
    by Dong, Bin
    Published 2016
    “... and aromatic precursors, present enhanced electron-hole separation as neutron detector. This is achieved...”
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  2. 2
    Atomic Layer Deposition of H-BN(0001) on Transition Metal Substrates, and In Situ XPS Study of Carbonate Removal from Lithium Garnet Surfaces
    by Jones, Jessica C.
    Published 2020
    Subjects: “...Low Energy Electron Diffraction...”
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  3. 3
    Passivation effects of surface iodine layer on tantalum for the electroless copper deposition.
    by Liu, Jian
    Published 2004
    “... was investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Although...”
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  4. 4
    Direct Atomic Level Controlled Growth and Characterization of h-BN and Graphene Heterostructures on Magnetic Substrates for Spintronic Applications
    by Beatty, John D.
    Published 2016
    “...(0001) substrate. Low energy electron diffraction (LEED) measurements indicate azimuthally oriented...”
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  5. 5
    Electrodeposition of adherent copper film on unmodified tungsten.
    by Wang, Chen
    Published 2004
    “... or not. Characterization by scanning electron microscopy (SEM), energy dispersive X-ray (EDX) and X-ray photon spectroscopy...”
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  6. 6
    High-Temperature Corrosion of Aluminum Alloys: Oxide-Alloy Interactions and Sulfur Interface Chemistry
    by Addepalli, Swarnagowri
    Published 2000
    “... corrosion of aluminum alloys in the presence of sulfur. Auger electron spectroscopy (AES), low energy...”
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  7. 7
    Adherence/Diffusion Barrier Layers for Copper Metallization: Amorphous Carbon:Silicon Polymerized Films
    by Pritchett, Merry
    Published 2004
    “.... Vinyltrimethylsilane (VTMS) precursor was condensed on a titanium substrate at 90 K and bombarded with electron beams...”
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  8. 8
    Adhesion/Diffusion Barrier Layers for Copper Integration: Carbon-Silicon Polymer Films and Tantalum Substrates
    by Chen, Li
    Published 1999
    “... by electron beam bombardment or ultraviolet (UV) radiation of molecularly adsorbed vinyl silane precursors...”
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  9. 9
    Process Evaluation and Characterization of Tungsten Nitride as a Diffusion Barrier for Copper Interconnect Technology
    by Ekstrom, Bradley Mitsuharu
    Published 2005
    “... electron spectroscopy (AES) and thermal desorption spectroscopy (TDS) under controlled ultra high vacuum...”
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  10. 10
    Tantalum- and ruthenium-based diffusion barriers/adhesion promoters for copper/silicon dioxide and copper/low κ integration.
    by Zhao, Xiaopeng
    Published 2004
    “... at an average thickness corresponding to 1 monolayer average coverage. Ru(0) is the only electronic state...”
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  11. 11
    Study of Interactions Between Diffusion Barrier Layers and Low-k Dielectric Materials for Copper/Low-k Integration
    by Tong, Jinhong
    Published 2003
    “... techniques, such as X-ray photoelectronic spectroscopy (XPS), transmission electron microscopy (TEM...”
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