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“... for reliability in Sn-based conducting materials that are used in advanced microelectronic packages with micro...”
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“... of electron backscatter diffraction (EBSD) and transmission electron microscope (TEM) showed that the Cu grain...”
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“... electronic industry have pushed PCB and chip carrier board manufacturers to seek a more adequate surface...”
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“... scanning electron microscope (FE-SEM) in combination with electron backscatter diffraction (EBSD) analysis...”
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