“... benefits will vary depending on the applications, the package type and the production environment. Only...”
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“...碩士 === 國立臺北科技大學 === 工業工程與管理系 === 106 === The development of electronic packaging technology...”
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“...碩士 === 國立臺北科技大學 === 工業工程與管理研究所 === 99 === Epoxy resin is current material for LED packaging process...”
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“... higher density packages to increase product functionality. As for portable electronic products, solder...”
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“... Electronics products has resulted in extreme complexity in the packaging and assembly technology. The solder...”
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“..., the issue of green package is serious importance. While the traditional solder reflow process is replaced...”
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