Showing 1 - 2 results of 2 for search 'ADVANCED MECHANICS OF MATERIALS', query time: 2.21s Refine Results
  1. 1
    On the Study of Flexural Strength and Bending Fatigue Life of Ultra-thin Glass Substrate
    by Li, Kuan-Hung, 黎冠宏
    Published 2017
    “... advantages over other flexible substrate materials for flexible electronics or printed electronics, including...”
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  2. 2
    Reliability Evaluation of Cu/Ni/SnAg Micro-Bump Interconnects of High-Density, Ultra-Fine-Pitch 3D Chip-on-Chip Stacking Electronic Packaging
    by Tsai, Yu-Min, 蔡煜民
    Published 2011
    “... the advancement of electronic packaging technologies toward system integration. One of the promising solutions...”
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