“...碩士 === 華梵大學 === 工業管理學系碩士班 === 90 === The market demand has driven the production environment toward...”
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“... products toward the increased functionality and end product size/weight miniaturation. The above mentioned...”
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“... in electronics coupled by a market driven requirement to decrease the size and weight of the end product has...”
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“... of end product and lower production cost in the electronics packaging and assembly. SMT includes...”
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“...碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 93 === In the electronics packaging, Surface Mount Technology...”
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“... products has resulted in extreme complexity in the packaging and assembly technology. The solder balls...”
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“...碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 95 === Portable electronic product such as digital camera, smart...”
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“... printing process and lack of quality control. This study investigated the quad flat package (QFP...”
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